MRM2023/IUMRS-ICA2023

Presentation information

Oral Session

G. Process » [G-3] Joining and Welding for Advanced Materials

[G3-O503] Oral 503

Fri. Dec 15, 2023 4:30 PM - 6:30 PM Session 17 (Room 509)

Chair: Yu-An Shen (Feng Chia University)

6:10 PM - 6:30 PM

[G3-O503-06] Laser soldering interconnected Al FPCB/Cu FPCB lap joints for use in battery applications: SAC305 vs. Sn-57Bi-1Ag solder materials

*Eunjin Jo1,2, Seoah Kim1,3, Hyeonsung Lee4, YehRi Kim1,5, Young-Bae Park2, Sehoon Yoo1, Dongjin Kim1 (1. Korea Institute of Industrial Tech. (Korea), 2. Andong National Univ. (Korea), 3. Kyonggi Univ. (Korea), 4. 4YURA Corp. (Korea), 5. Korea Univ. (Korea))

Keywords:FPCBs, SAC305, Sn-57wt%-1wt%Bi, Laser soldering, Lap joint bonding

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