Adhesive-free multi-materialization of fluoropolymers via heat-assisted plasma treatment

Yosuke Seto

Presentation information

Special Session

Special Session » IV: 未来につなげる接着・接合、未来とつながる表面・界面

IV: 未来につなげる接着・接合、未来とつながる表面・界面

Tue. Nov 30, 2021 12:50 PM - 2:10 PM Room D (Online)

座長:村上裕人(長崎大学)

1:30 PM - 1:50 PM

[D-103] Adhesive-free multi-materialization of fluoropolymers via heat-assisted plasma treatment

*Yosuke Seto¹, Misa Nishino¹, Yuki Okazaki¹, Kwai Seiya¹, Erika Miyake¹, Katsuyoshi Endo¹, Kazuya Yamamura¹, Yuji Ohkubo¹ (1. Graduate School of Engineering, Osaka University)

Keywords:フッ素樹脂、プラズマ、接着剤レス、Beyond 5G

Abstract password authentication.
Password is required to view the abstract. Please enter a password to authenticate.