Adhesive-free multi-materialization of fluoropolymers via heat-assisted plasma treatment

Yosuke Seto

Presentation information

Poster

Poster » Poster（P22～42）

ポスター（P22～42）

Tue. Nov 30, 2021 10:00 AM - 12:00 PM Poster Room2 (Online)

発表時間
前半(奇数番号):10:00-10:50
後半(偶数番号):11:10-12:00

[P38] Adhesive-free multi-materialization of fluoropolymers via heat-assisted plasma treatment

*Yosuke Seto¹, Misa Nishino¹, Yuki Okazaki¹, Kwai Seiya¹, Erika Miyake¹, Katsuyoshi Endo¹, Kazuya Yamamura¹, Yuji Ohkubo¹ (1. Graduate School of Engineering, Osaka University)

Keywords:フッ素樹脂、プラズマ、接着剤レス、Beyond 5G

Abstract password authentication.
Password is required to view the abstract. Please enter a password to authenticate.