1:30 PM - 2:00 PM

[K-1-01(Invited)] Electrostatic Perturbations from TSV Processing during 3D Integration of Advanced CMOS Technologies

^○C. Kothandaraman¹, K. Sakuma¹, S. A. Cohen¹ (1.T.J. Watson Research Center, IBM Research(USA))

https://doi.org/10.7567/SSDM.2016.K-1-01