2017 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: CMOS Devices / Device Physics

[E-6] 3D Technology

Fri. Sep 22, 2017 11:15 AM - 12:25 PM Tachibana Conference Room (Conference building 2F, Sendai International Center)

Session Chair: K. Sukegawa(Socionext Inc.), F. L. Yang(Academia Sinica)

11:15 AM - 11:45 AM

[E-6-01 (Invited)] Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D+ IoT Chip Using Low Thermal Budget Laser Technology

C. -C. Yang1, T. -Y. Hsieh1, W. -H. Huang1, J. -M. Shieh1, H. -H. Wang1, C. -H. Shen1, F. -K. Hsueh1, W. -K. Yeh1 (1.National Nano Device Labs. (Taiwan))

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