2017 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

02: Interconnect Technologies, MEMS, and Reliability

[H-5] TSV & 3D Integration

Fri. Sep 22, 2017 9:30 AM - 11:00 AM Meeting Room 6 (Conference building 3F, Sendai International Center)

Session Chair: M. Mariappan(Tohoku Univ.), S. Ogawa(AIST)

9:30 AM - 10:00 AM

[H-5-01 (Invited)] Advanced Packaging Technology to Address Micro-bump Solder Bonding and Warpage in Large-die 3D IC using 22nm ULK Dielectrics

K. Sakuma1, J. Knickerbocker1 (1.IBM T. J. Watson Research Center (USA))

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