9:30 AM - 10:00 AM
[H-5-01 (Invited)] Advanced Packaging Technology to Address Micro-bump Solder Bonding and Warpage in Large-die 3D IC using 22nm ULK Dielectrics
Abstract password authentication.
You can find the password in the "Advance Program".
The "Advance Program" is handed out at the registration desk to registered participants.