The Japan Society of Applied Physics

2:00 PM - 2:30 PM

[G-1-01 (Invited)] Fully Aligned Via Integration for beyond 7 nm

D. Sil1, B.D. Briggs1, C.B. Peethala1, D.L. Rath1, J. Lee1, S. Nguyen1, N.V. LiCausi3, H. You3, N.A. Lanzillo1, H. Huang1, R. Patlolla1, T. Haigh Jr1, Y. Xu1, C. Park3, H.K. Shobha1, Y. Kim4, J. Lee4, J. Demarest1, J. Li1, G. Lian2, M. Ali2, C.T. Le2, E.T. Ryan3, P. Mennell3, L.A. Clevenger1, D.F. Canaperi1, T.E. Standaert1, G. Bonilla1, E. Huang1, K. Choi1, B.S. Haran1 (1.IBM Res. (USA), 2.IBM Systems (USA), 3.GLOBALFOUNDRIES Inc. (USA), 4.Samsung Electronics (Korea))

https://doi.org/10.7567/SSDM.2018.G-1-01