2018 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-1] Interconnect-I

Tue. Sep 11, 2018 2:00 PM - 3:15 PM Room 231 (School of Engineering Bldg.2 North Wing third floor)

Session Chair: M. Ueki (Sony Semiconductor Manufacturing Corp.), M.B. Takeyama (Kitami Inst. of Tech.)

2:00 PM - 2:30 PM

[G-1-01 (Invited)] Fully Aligned Via Integration for beyond 7 nm

D. Sil1, B.D. Briggs1, C.B. Peethala1, D.L. Rath1, J. Lee1, S. Nguyen1, N.V. LiCausi3, H. You3, N.A. Lanzillo1, H. Huang1, R. Patlolla1, T. Haigh Jr1, Y. Xu1, C. Park3, H.K. Shobha1, Y. Kim4, J. Lee4, J. Demarest1, J. Li1, G. Lian2, M. Ali2, C.T. Le2, E.T. Ryan3, P. Mennell3, L.A. Clevenger1, D.F. Canaperi1, T.E. Standaert1, G. Bonilla1, E. Huang1, K. Choi1, B.S. Haran1 (1.IBM Res. (USA), 2.IBM Systems (USA), 3.GLOBALFOUNDRIES Inc. (USA), 4.Samsung Electronics (Korea))

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