2018 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-3] 3D Intergration

Wed. Sep 12, 2018 9:00 AM - 10:15 AM Room 231 (School of Engineering Bldg.2 North Wing third floor)

Session Chair: Y. Orii (NAGASE & CO., LTD.), M. Mariappan (Tohoku Univ.)

9:00 AM - 9:30 AM

[G-3-01 (Invited)] A Moore's law for Packaging

S.S. Iyer1 (1.UCLA (USA))

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