2018 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-6] Interconnect-II

Wed. Sep 12, 2018 3:15 PM - 4:15 PM Room 231 (School of Engineering Bldg.2 North Wing third floor)

Session Chair: T. Nogami(IBM Research), M. Kodera(Moses Lake Industries, Inc.)

3:15 PM - 3:45 PM

[G-6-01 (Invited)] Conductor trends for future interconnects

Z. Tokei1 (1. IMEC(Belgium))