2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[J-1] Advanced Interconnects

Tue. Sep 3, 2019 2:00 PM - 3:45 PM IB013 (IB 1F)

Session Chair: M. Ueki (Sony Semiconductor Manufacturing Corp.), M.B. Takeyama (Kitami Inst. of Tech.)

2:00 PM - 2:30 PM

[J-1-01 (Invited)] Electromigration scaling limits of copper interconnects

O.V. Pedreira1, H. Zahedmanesh1, I. Ciofi1, Z. TÖkei1, K. Croes1 (1.imec (Belgium))

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