2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[J-5] 3D Integration II

Thu. Sep 5, 2019 9:00 AM - 10:15 AM IB013 (IB 1F)

Session Chair:M. Kodera (Moses Lake Industries, Inc.), M. Mariappan(Tohoku Univ.)

9:00 AM - 9:30 AM

[J-5-01 (Invited)] Wafer to Wafer Stacking and Hybrid Bonding for Heterogeneous Integration

K. Takahashi1 (1. AIST(Japan))