2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

04: Power Devices / High-speed Devices, and Materials

[K-3] Si Power Technologies

Wed. Sep 4, 2019 9:00 AM - 10:30 AM IB014 (IB 1F)

Session Chair: T. Terashima (Mitsubishi Electric Corp.), T. Matsudai (Toshiba Electronic Devices & Storage Corp.)

9:00 AM - 9:30 AM

[K-3-01 (Invited)] State-of-the Art IGBT and Development towards Higher Operation Temperature and Power Ratings

J. Vobecky1, C. Corvasce1, E. Buitrago1, M. Andenna1, B. Boksteen1, G. Paques1 (1.ABB Semiconductors (Switzerland))

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