2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

04: Power Devices / High-speed Devices, and Materials

[K-3] Si Power Technologies

Wed. Sep 4, 2019 9:00 AM - 10:30 AM IB014 (IB 1F)

Session Chair:T. Terashima(Mitsubishi Electric Corp.), T. Matsudai(Toshiba Electronic Devices & Storage Corp.)

9:00 AM - 9:30 AM

[K-3-01 (Invited)] State-of-the Art IGBT and Development towards Higher Operation Temperature and Power Ratings

J. Vobecky1, C. Corvasce1, E. Buitrago1, M. Andenna1, B. Boksteen1, G. Paques1 (1. ABB Switzerland Ltd, Semiconductors(Switzerland))