2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

01: Advanced CMOS: Material Fundamentals, Process Science and Device Physics

[N-4] 3D and Stacking Technology

Wed. Sep 4, 2019 3:30 PM - 4:30 PM IB Lecture Hall (IB 2F)

Session Chair: H. Oishi (Sony Semiconductor Solutions Corp.), F.L. Yang (Academia Sinica)

3:30 PM - 4:00 PM

[N-4-01 (Invited)] Recent progress in sequential 3D device stacking: Low temperature reliable top tier junction-less devices on 300mm wafers.

A. Vandooren1, J. Franco1, Z. Wu1, B. Parvais1, G. Besnard2, W. Schwarzenbach2, I. Radu2, B.-Y. Nguyen2, N. Collaert (1.imec (Belgium), 2.SOITEC (France))

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