2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

01: Advanced CMOS: Material Fundamentals, Process Science and Device Physics

[N-4] 3D and Stacking Technology

Wed. Sep 4, 2019 3:30 PM - 4:30 PM IB Lecture Hall (IB 2F)

Session Chair:H. Oishi(Sony Semiconductor Solutions Corp.), F. L. Yang(Academia Sinica)

3:30 PM - 4:00 PM

[N-4-01 (Invited)] Recent progress in sequential 3D device stacking: Low temperature reliable top tier junction-less devices on 300mm wafers.

A. Vandooren1, J. Franco1, Z. Wu1, B. Parvais1, G. Besnard2, W. Schwarzenbac2, I. Radu2, B.-Y. Nguyen2, N. Collaert (1. IMEC(Belgium), 2. SOITEC(France))