2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

01: Advanced CMOS: Material Fundamentals, Process Science and Device Physics

[N-4] 3D and Stacking Technology

Wed. Sep 4, 2019 3:30 PM - 4:30 PM IB Lecture Hall (IB 2F)

Session Chair: H. Oishi (Sony Semiconductor Solutions Corp.), F.L. Yang (Academia Sinica)

4:00 PM - 4:15 PM

[N-4-02] Bottom Tier High Voltage Vevice Thermal Stability in 3D Sequential Integration for More than Moore Applications

C. Cavalcante1,2,3, G. Ghibaudo2, X. Garros1, M. Cassé1, T. Karatsori2, J. Lacord1, C. Fenouillet1, N. Rambal1, O. Rozeau1, J.P. Colinge1, M. Vinet1, D. Lattard1, F. Andrieu1, P. Batude1 (1.Lab. CEA-LETI, MINATEC (France), 2.Inst. IMEP-LAHC, Grenoble INP (France), 3.Univ. Grenoble Alpes (France))

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