2020 International Conference on Solid State Devices and Materials

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Oral presentation

03: Interconnect / 3D Integrations / MEMS

[C-1] Advanced Interconnects & 3D Integration I

Mon. Sep 28, 2020 2:00 PM - 3:30 PM Room C

Session Chair: Takeshi Nogami (IBM Research), Mayumi B. Takeyama (Kitami Inst. of Tech.)

2:00 PM - 2:30 PM

[C-1-01 (Invited)] Novel low k Dielectric materials for nano device interconnect technology

〇Son Nguyen1, Hosadurga Shobha1, Thomas Haigh1, James Chen1, Joe Lee1, Takeshi Nogami1, Eric Liniger1, Stephan Cohen1, Chao-Kun Hu1, Huai Huang1, Yiping Yao1, Donald Canaperi1, Cornelius Brown Peethala1, Theo Standaert1, Griselda Bonilla1 (1. IBM Research(United States of America))

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