Novel low k Dielectric materials for nano device interconnect technology

Son Nguyen

doi:https://doi.org/10.7567/SSDM.2020.C-1-01

2:00 PM - 2:30 PM

[C-1-01 (Invited)] Novel low k Dielectric materials for nano device interconnect technology

〇Son Nguyen¹, Hosadurga Shobha¹, Thomas Haigh¹, James Chen¹, Joe Lee¹, Takeshi Nogami¹, Eric Liniger¹, Stephan Cohen¹, Chao-Kun Hu¹, Huai Huang¹, Yiping Yao¹, Donald Canaperi¹, Cornelius Brown Peethala¹, Theo Standaert¹, Griselda Bonilla¹ (1. IBM Research(United States of America))

https://doi.org/10.7567/SSDM.2020.C-1-01

2020 International Conference on Solid State Devices and Materials

[C-1-01 (Invited)] Novel low k Dielectric materials for nano device interconnect technology