2022 International Conference on Solid State Devices and Materials

Session information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[E-7] MEMS and Advanced Metallization II

Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)

Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

9:30 AM - 9:45 AM

〇Tadaaki Hoshi1, Yuki Susumago1, Liu Chang1, Atsushi Shinoda2, Hisashi Kino3, Tetsu Tanaka1,3, Takafumi Fukushima1,3 (1. Dept. of Mechanical Systems Engineering, Graduate School of Engineering, Univ. of Tohoku (Japan), 2. Dept. of Mechanical and Aerospace Engineering, School of Engineering, Univ of Tohoku (Japan), 3. Dept. of Biomedical Engineering, Graduate School of Biomedical Engineering, Univ. of Tohoku (Japan))

Presentation style: Online

10:15 AM - 10:30 AM

〇Shun Nakajima1, Yoko Wasai2, Kenji Kawahara3, Nataliya Nabatova-Gabain2, Hiroki Ago3, Hiroyuki Akinaga4, Kazuyoshi Ueno1 (1. Shibaura Inst. Tech. (Japan), 2. Horiba Techno Service Co. Ltd. (Japan), 3. Kyushu Univ. (Japan), 4. Nat. Inst. Adv. Indus. Sci. Tech. (Japan))

Presentation style: On-site (in-person)
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