〇Tadashi Inoue¹ (1. MMI Semiconductor Co., Ltd. (Japan))

〇Tadaaki Hoshi¹, Yuki Susumago¹, Liu Chang¹, Atsushi Shinoda², Hisashi Kino³, Tetsu Tanaka^1,3, Takafumi Fukushima^1,3 (1. Dept. of Mechanical Systems Engineering, Graduate School of Engineering, Univ. of Tohoku (Japan), 2. Dept. of Mechanical and Aerospace Engineering, School of Engineering, Univ of Tohoku (Japan), 3. Dept. of Biomedical Engineering, Graduate School of Biomedical Engineering, Univ. of Tohoku (Japan))

〇Wei-Rong Yang¹, Yu-Shun Su¹, Jenn-Ming Song¹, Watson Kuo¹, Shien-Der Tzeng², Kiyokazu Yasuda³ (1. National Chung Hsing University (Taiwan), 2. National Dong Hwa University (Taiwan), 3. Osaka University (Japan))

〇Akinobu Yamaguchi¹, Taku Tanaka¹, Shunya Saegusa¹, Masayuki Naya^2,1, Takao Fukuoka³, Sho Amano¹, Yuichi Utsumi¹ (1. Univ. of Hyogo (Japan), 2. Keio Univ. (Japan), 3. Kyoto Univ. (Japan))

〇Shun Nakajima¹, Yoko Wasai², Kenji Kawahara³, Nataliya Nabatova-Gabain², Hiroki Ago³, Hiroyuki Akinaga⁴, Kazuyoshi Ueno¹ (1. Shibaura Inst. Tech. (Japan), 2. Horiba Techno Service Co. Ltd. (Japan), 3. Kyushu Univ. (Japan), 4. Nat. Inst. Adv. Indus. Sci. Tech. (Japan))

〇Takeyasu Saito¹, Kohei Yamada¹, Ryosuke Komoda¹, Naoki Okamoto¹ (1. Osaka Metropolitan University (Japan))