2022 International Conference on Solid State Devices and Materials

Session information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-1] 3D Integration and Advanced Packaging I

Tue. Sep 27, 2022 11:30 AM - 12:30 PM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Jenn-Ming Song (National Chung Hsing Univ.)

×

Authentication

×

Please log in to browse and/or download abstracts.
» Participant Log In