11:30 AM - 11:45 AM
〇CHANG LIU1, Yuki Susumago1, Tadaaki Hoshi1, Hisashi Kino2, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomed. Eng., Tohoku Univ. (Japan))
Oral Presentation
03: Interconnect / 3D Integrations / MEMS
Tue. Sep 27, 2022 11:30 AM - 12:30 PM 304 (3F)
Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Jenn-Ming Song (National Chung Hsing Univ.)
11:30 AM - 11:45 AM
〇CHANG LIU1, Yuki Susumago1, Tadaaki Hoshi1, Hisashi Kino2, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomed. Eng., Tohoku Univ. (Japan))
11:45 AM - 12:00 PM
〇Wei FENG1, Haruo Shimamoto1, Tsuyoshi Kawagoe2, Ichirou Honma2, Masato Yamasaki2, Fumitake Okutsu2, Takatoshi Masuda2, Katsuya Kikuchi1 (1. National Inst. of Advanced Indus. Sci. and Tech. (AIST) (Japan), 2. UltraMemory Inc. (Japan))
12:00 PM - 12:15 PM
〇Aoba Onishi1, Ryotaro Bamba1, Bungo Tanaka1, Ryouhei Kishimoto2, Hisashi Kino1, Takafumi Fukushima1,2, Tetsu Tanaka1,2 (1. Dep. of Biomed. Eng., Graduate School of Biomed. Eng., Tohoku Univ. (Japan), 2. Dep. of Mech. Sys. Eng., Graduate School of Eng., Tohoku Univ. (Japan))
12:15 PM - 12:30 PM
〇Yuuki Araga1, Hiroshi Nakagawa1, Masaru Hashino1, Katsuya Kikuchi1 (1. National Inst. of Advanced Indus. Sci. and Tech. (AIST) (Japan))
Please log in to browse and/or download abstracts.
» Participant Log In