2022 International Conference on Solid State Devices and Materials

セッション情報

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-1] 3D Integration and Advanced Packaging I

2022年9月27日(火) 11:30 〜 12:30 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Jenn-Ming Song (National Chung Hsing Univ.)

12:00 〜 12:15

〇Aoba Onishi1, Ryotaro Bamba1, Bungo Tanaka1, Ryouhei Kishimoto2, Hisashi Kino1, Takafumi Fukushima1,2, Tetsu Tanaka1,2 (1. Dep. of Biomed. Eng., Graduate School of Biomed. Eng., Tohoku Univ. (Japan), 2. Dep. of Mech. Sys. Eng., Graduate School of Eng., Tohoku Univ. (Japan))

Presentation style: Online
×

認証

×

Please log in to browse and/or download abstracts.
» 参加者用ログイン