Oral Presentation
03: Interconnect / 3D Integrations / MEMS
Wed. Sep 28, 2022 9:00 AM - 10:15 AM 304 (3F)
Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Xun Gu (ASM Japan)
9:00 AM - 9:30 AM
〇Subramanian S. Iyer1 (1. ULCA (United States of America))
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9:30 AM - 9:45 AM
〇Yuki Susumago1, Tadaaki Hoshi1, Chang Liu1, Atushi Shinoda2, Hisashi Kino3, Tetsu Tanaka1,3, Takafumi Fukushima1,3 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. School of Eng., Tohoku Univ. (Japan), 3. Graduate School of Biomed. Eng., Tohoku Univ. (Japan))
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9:45 AM - 10:00 AM
〇Junsha Wang1, Ryo Takigawa2, Tadatomo Suga1 (1. Meisei Univ. (Japan), 2. Kyushu Univ. (Japan))
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10:00 AM - 10:15 AM
Kai Zhao1, 〇Haitao He1, Junchen Dong1, Yudi Zhao1 (1. Beijing Information Science and Technology University (China))
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