2022 International Conference on Solid State Devices and Materials

Session information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-4] Design, Process, and Technology for High-performance Chiplet II/3D Integration and Advanced Packaging II

Wed. Sep 28, 2022 9:00 AM - 10:15 AM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Xun Gu (ASM Japan)

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