〇Koki Ono¹, Takashi Koide¹, Yong Jin², Yuuki Tsutiizu¹, Takuhiro Hasegawa¹, Shigeo Yasuhara², Wakana Takeuchi¹ (1. Aichi Institute Technology (Japan), 2. Japan Advanced Chemicals Ltd. (Japan))

Presentation style: On-site (in-person)

14:45 〜 15:00

[K-6-05 (Late News)] Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material

〇Takeyasu Saito¹, Kazunobu WAKAMATSU¹, Kazuki UEDA¹, Naoki OKAMOTO¹ (1. Osaka Metropolitan Univ. (Japan))

Presentation style: On-site (in-person)

15:00 〜 15:15

[K-6-06] 18nm pitch EUVL Line/Space double-patterning exploration for N3 BEOL

〇Stephane LARIVIERE¹, Stefan DECOSTER¹, Sara PAOLILLO¹, Vincent RENAUD¹, Diana TSVETANOVA¹, Bart KENENS¹, Hanne DE COSTER¹, Quoc Toan LE¹, Yusuke ONIKI¹, Alfonso SEPULVEDA MARQUEZ¹, Karen STIERS¹, Felix SEIDEL¹, Martin O'TOOLE¹, Mircea DUSA¹, Kurt RONSE¹, Chris WILSON¹ (1. imec (Belgium))

Presentation style: On-site (in-person)

15:15 〜 15:30

[K-6-07] Demonstrating 1T1R Memory Cell by Heterogeneous Integration of Zinc Oxide Thin-Film Transistor with SiC-based Memristor

〇Ben Daniel Rowlinson¹, Omesh Kapur¹, Dongkai Guo¹, Ruomeng Huang¹, C.H. de Groot¹, Harold Chong¹ (1. University of Southampton (UK))

Presentation style: On-site (in-person)

セッション情報

[K-6] MEMS and Advanced Metallization I

[K-6-01 (Invited)] Further Scaling Challenges and Opportunities

[K-6-02] Evaluating Sintered Silver Die-attach Thermal Cycling Degradation
by Nine Point Cycling Bending Test

[K-6-03] Concentration Monitoring of H₂O₂ Based Slurry for Metal Chemical Mechanical Planarization (CMP) using Raman Spectroscopy

[K-6-04 (Late News)] Growth of SiC Thin Film on Various Metal Substrates by CVD Using Vinylsilane

[K-6-05 (Late News)] Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material

[K-6-06] 18nm pitch EUVL Line/Space double-patterning exploration for N3 BEOL

[K-6-07] Demonstrating 1T1R Memory Cell by Heterogeneous Integration of Zinc Oxide Thin-Film Transistor with SiC-based Memristor

認証

セッション情報

[K-6] MEMS and Advanced Metallization I

[K-6-01 (Invited)] Further Scaling Challenges and Opportunities

[K-6-02] Evaluating Sintered Silver Die-attach Thermal Cycling Degradationby Nine Point Cycling Bending Test

[K-6-03] Concentration Monitoring of H2O2 Based Slurry for Metal Chemical Mechanical Planarization (CMP) using Raman Spectroscopy

[K-6-04 (Late News)] Growth of SiC Thin Film on Various Metal Substrates by CVD Using Vinylsilane

[K-6-05 (Late News)] Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material

[K-6-06] 18nm pitch EUVL Line/Space double-patterning exploration for N3 BEOL

[K-6-07] Demonstrating 1T1R Memory Cell by Heterogeneous Integration of Zinc Oxide Thin-Film Transistor with SiC-based Memristor

認証

[K-6-02] Evaluating Sintered Silver Die-attach Thermal Cycling Degradation
by Nine Point Cycling Bending Test

[K-6-03] Concentration Monitoring of H₂O₂ Based Slurry for Metal Chemical Mechanical Planarization (CMP) using Raman Spectroscopy