- Oral Presentation
- | 03: Interconnect / 3D Integrations / MEMS
Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)
Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)
75 results (31 - 40)
Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)
Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)
Tue. Sep 27, 2022 11:30 AM - 12:30 PM 201 (2F)
Session Chair: Halid Mulaosmanovic (GlobalFoundries), Norikatsu Takaura (Hitachi, Ltd.)
Tue. Sep 27, 2022 2:00 PM - 3:30 PM 201 (2F)
Session Chair: Atsushi Himeno (Panasonic Corporation), Laurent Grenouillet (CEA-Leti)
Tue. Sep 27, 2022 4:15 PM - 6:00 PM 201 (2F)
Session Chair: Laurent Grenouillet (CEA-Leti), Hiroshi Naganuma (Tohoku Univ.)
Wed. Sep 28, 2022 9:00 AM - 10:15 AM 201 (2F)
Session Chair: Xu Bai (NanoBridge Semiconductor, Inc.), Atsushi Himeno (Panasonic Corporation)
Wed. Sep 28, 2022 10:45 AM - 12:00 PM 201 (2F)
Session Chair: E Ray Hsieh (National Central Univ.), Keiji Hosotani (KIOXIA Corp.)
Wed. Sep 28, 2022 1:30 PM - 3:00 PM 201 (2F)
Session Chair: Hiroki Sasaki (MIRISE Technologies Corp.), E Ray Hsieh (National Central Univ.)
Thu. Sep 29, 2022 9:00 AM - 10:15 AM 201 (2F)
Session Chair: Halid Mulaosmanovic (GlobalFoundries), Hiroki Sasaki (MIRISE Technologies Corp.)
Thu. Sep 29, 2022 10:45 AM - 12:00 PM 201 (2F)
Session Chair: Keiji Hosotani (KIOXIA Corp.), Xu Bai (NanoBridge Semiconductor, Inc.)
Thu. Sep 29, 2022 1:30 PM - 3:15 PM 201 (2F)
Session Chair: Toshifumi Irisawa (AIST), Hiroshi Naganuma (Tohoku Univ.)