2022 International Conference on Solid State Devices and Materials

Sessions

Wed. Sep 28, 2022

28 results  (21 - 28)

  • Oral Presentation
  • | 04: Power / High-speed Devices and Materials

[J-4] Ultrawide Bandgap Semiconductor Devices

Wed. Sep 28, 2022 9:00 AM - 10:15 AM 303 (3F)

Session Chair: Heiji Watanabe (Osaka Univ.), Hironori Okumura (Univ. of Tsukuba)

  • Oral Presentation
  • | 04: Power / High-speed Devices and Materials

[J-5] SiC Processes and Characterizations

Wed. Sep 28, 2022 10:45 AM - 12:00 PM 303 (3F)

Session Chair: Kung-Yen Lee (National Taiwan Univ.), Naoki Watanabe (Hitachi, Ltd.)

  • Oral Presentation
  • | 04: Power / High-speed Devices and Materials

[J-6] Interface Technologies

Wed. Sep 28, 2022 1:30 PM - 3:45 PM 303 (3F)

Session Chair: Yuichi Onozawa (Fuji Electric Corp.), Shinsuke Harada (AIST)

  • Oral Presentation
  • | 12: Advanced Circuits / Systems Interacting with Innovative Devices and Materials

[K-5] Advanced Neuron and AI Systems

Wed. Sep 28, 2022 10:45 AM - 12:00 PM 304 (3F)

Session Chair: Takeshi Yoshida (Hiroshima Univ.), Yitao Ma (Tohoku Univ.)

  • Oral Presentation
  • | 03: Interconnect / 3D Integrations / MEMS

[K-6] MEMS and Advanced Metallization I

Wed. Sep 28, 2022 1:30 PM - 3:30 PM 304 (3F)

Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)