2022 International Conference on Solid State Devices and Materials

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[E-7] MEMS and Advanced Metallization II

2022年9月29日(木) 09:00 〜 10:45 105 (1F)

Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

09:00 〜 09:30

[【Cancelled】E-7-01 (Invited)] Strategy of Wafer Bonding Techniques in Commercial MEMS

〇Tadashi Inoue1 (1. MMI Semiconductor Co., Ltd. (Japan))

Presentation style: Online

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