Strategy of Wafer Bonding Techniques in Commercial MEMS

Presentation information

Cancelled

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)

Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

9:00 AM - 9:30 AM

〇Tadashi Inoue¹ (1. MMI Semiconductor Co., Ltd. (Japan))

Presentation style: Online

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