2022 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[E-7] MEMS and Advanced Metallization II

Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)

Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

9:30 AM - 9:45 AM

[E-7-02] Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display

〇Tadaaki Hoshi1, Yuki Susumago1, Liu Chang1, Atsushi Shinoda2, Hisashi Kino3, Tetsu Tanaka1,3, Takafumi Fukushima1,3 (1. Dept. of Mechanical Systems Engineering, Graduate School of Engineering, Univ. of Tohoku (Japan), 2. Dept. of Mechanical and Aerospace Engineering, School of Engineering, Univ of Tohoku (Japan), 3. Dept. of Biomedical Engineering, Graduate School of Biomedical Engineering, Univ. of Tohoku (Japan))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.E-7-02

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