2022 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[E-7] MEMS and Advanced Metallization II

Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)

Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

10:15 AM - 10:30 AM

[E-7-05 (Late News)] Assessment for Moisture Resistance Reliability of Graphene-Capped Copper Structures by Spectroscopic Ellipsometry

〇Shun Nakajima1, Yoko Wasai2, Kenji Kawahara3, Nataliya Nabatova-Gabain2, Hiroki Ago3, Hiroyuki Akinaga4, Kazuyoshi Ueno1 (1. Shibaura Inst. Tech. (Japan), 2. Horiba Techno Service Co. Ltd. (Japan), 3. Kyushu Univ. (Japan), 4. Nat. Inst. Adv. Indus. Sci. Tech. (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.E-7-05

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