2022 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

04: Power / High-speed Devices and Materials

[J-4] Ultrawide Bandgap Semiconductor Devices

Wed. Sep 28, 2022 9:00 AM - 10:15 AM 303 (3F)

Session Chair: Heiji Watanabe (Osaka Univ.), Hironori Okumura (Univ. of Tsukuba)

9:45 AM - 10:00 AM

[J-4-03] 2DHG diamond MOSFETs with multi-finger structure for gate width expansion and improved RF characteristics

〇Akira Takahashi1, Masakazu Arai1, Yukiko Suzuki1, Fuga Asai1, Atsushi Hiraiwa1, Masaomi Tsuru3, Yutaro Yamaguchi3, Yuji Komatsuzaki3, Ken Kudara3, Hiroshi Kawarada1,2 (1. Waseda univ Kawarada lab. (Japan), 2. Kagami Memorial Res. (Japan), 3. Mitsubishi Electric Corp. (Japan))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.J-4-03

We have fabricated a high frequency 2DHG diamond
MOSFET with an air-bridge structure to increase the
gate width for further increasing the MOSFET power.
We succeeded in realizing a multi-finger structure with an increased number of gate fingers from the conventional double-finger structure. DC and RF performance of the double-finger devices and multi-finger devices were compared and investigated. As a result, the multi-finger devices did not degrade the current density due to the increase of gate width (WGT), and the maximum oscillation frequency (fmax) was increased by 1.5 times.

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