2022 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

04: Power / High-speed Devices and Materials

[J-8] Si and SiC Power Devices

Thu. Sep 29, 2022 10:45 AM - 12:00 PM 303 (3F)

Session Chair: Tetsuya Nitta (Mitsubishi Electric Corp.), Tomoaki Hatayama (Sumitomo Electric Industries, Ltd.)

11:15 AM - 11:30 AM

[J-8-02] Poly Back Seal Effect on Platinum Solid Phase Diffusion in High Speed Switching Diodes

〇Yuhki Fujino1, Shotaro Baba1, Hiroaki Kato1, Shingo Sato1, Katsura Miyashita1 (1. Toshiba Electric Devices & Storage Corp. (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.J-8-02

We evaluated poly back seal (PBS) effect on platinum concentration profile during platinum solid phase diffusion in high speed switching diodes. We confirmed that the platinum concentration in PBS is kept constant and by far higher than that in silicon wafers. We also confirmed that the thicker the PBS, the more platinum is accumulated. It is also confirmed that PBS has no effects on the platinum concentration profile of the front side of the wafer after platinum solid phase diffusion, which is also verified in Qrr measurement.

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