2022 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

04: Power / High-speed Devices and Materials

[J-8] Si and SiC Power Devices

Thu. Sep 29, 2022 10:45 AM - 12:00 PM 303 (3F)

Session Chair: Tetsuya Nitta (Mitsubishi Electric Corp.), Tomoaki Hatayama (Sumitomo Electric Industries, Ltd.)

11:45 AM - 12:00 PM

[J-8-04] Experimental and Numerical Investigations of the Electrical Characteristics of SiC SBD-Integrated MOSFETs by Varying the Area Occupied by Embedded SBDs

〇Keisuke Kashiwa1, Mitsuki Takahashi1, Hiroshi Yano1, Noriyuki Iwamuro1 (1. Univ. of Tsukuba (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.J-8-04

This study describes the static and dynamic char-acteristics and withstanding capabilities of two types of 1.2-kV SiC SBD-integrated MOSFET, which have different SBD areas, using experimental validation and numerical simulations. In the MOSFETs with a larger SBD area, unipolar operation in the SBD during diode forward operation was maintained at higher forward currents; as a result, the MOSFETs show lower re-verse recovery and turn-on losses. However, the MOSFETs with a larger SBD area showed higher leakage current through the SBD during short-circuit transients owing to a higher electric field at the SBD, resulting in less short-circuit withstanding capability.

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