[K-1] 3D Integration and Advanced Packaging I

[K-1-04] Demonstration of 90,000 Superconductive Bump Connections
for Massive Quantum Computing

〇Yuuki Araga¹, Hiroshi Nakagawa¹, Masaru Hashino¹, Katsuya Kikuchi¹ (1. National Inst. of Advanced Indus. Sci. and Tech. (AIST) (Japan))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-1-04

We developed fabrication and bonding technology of superconductive bump for massive quantum computing. A bonded test vehicle demonstrates supercurrent through 90,000 series daisychain. Proposed bump consists of lead-indium alloy. The bumps land onto gold pad on the opposite chip and alloy with the gold pad for supercurent. The primary advantage of the proposed bump is the minimized damage to the pad chip, which is opposite of the bump. The plasma cleaning process can be omitted for the pad chip and less thermal damage by 100 degrees Celsius of bonding temperature which is lower than typical bonding process.