2022 International Conference on Solid State Devices and Materials

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Oral Presentation

Focus Session 3 (Area3&5&12)

[K-3] Design, Process, and Technology for High-performance Chiplet I

Tue. Sep 27, 2022 4:15 PM - 5:45 PM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Satoshi Iwamoto (Univ. of Tokyo)

4:15 PM - 4:45 PM

[K-3-01 (Invited)] Wafer Bonding Advances and 3D Applications

〇Hiroshi Yamamoto1 (1. EV Group Japan (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.K-3-01

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