2022 International Conference on Solid State Devices and Materials

講演情報

印刷

Oral Presentation

Focus Session 3 (Area3&5&12)

[K-3] Design, Process, and Technology for High-performance Chiplet I

2022年9月27日(火) 16:15 〜 17:45 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Satoshi Iwamoto (Univ. of Tokyo)

16:15 〜 16:45

[K-3-01 (Invited)] Wafer Bonding Advances and 3D Applications

〇Hiroshi Yamamoto1 (1. EV Group Japan (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.K-3-01

Abstract password authentication.
Password to download abstracts has been informed in the confirmation mail.

パスワード