2022 International Conference on Solid State Devices and Materials

講演情報

印刷

Oral Presentation

Focus Session 3 (Area3&5&12)

[K-3] Design, Process, and Technology for High-performance Chiplet I

2022年9月27日(火) 16:15 〜 17:45 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Satoshi Iwamoto (Univ. of Tokyo)

17:15 〜 17:45

[K-3-03 (Invited)] Advanced Encapsulants for Compound Semiconductor Package

〇Kuo-Chan Chiou1 (1. Industrial Technology Research Institute (Taiwan))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-3-03

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