2022 International Conference on Solid State Devices and Materials

講演情報

印刷

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-4] Design, Process, and Technology for High-performance Chiplet II/3D Integration and Advanced Packaging II

2022年9月28日(水) 09:00 〜 10:15 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Xun Gu (ASM Japan)

09:00 〜 09:30

[K-4-01 (Invited)] Heterogenous Integration on Flexible Substrates

〇Subramanian S. Iyer1 (1. ULCA (United States of America))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-4-01

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