2022 International Conference on Solid State Devices and Materials

講演情報

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-4] Design, Process, and Technology for High-performance Chiplet II/3D Integration and Advanced Packaging II

2022年9月28日(水) 09:00 〜 10:15 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Xun Gu (ASM Japan)

10:00 〜 10:15

[K-4-04] Modeling of Redistribution Layers and Through Glass Vias on Glass Interposers

Kai Zhao1, 〇Haitao He1, Junchen Dong1, Yudi Zhao1 (1. Beijing Information Science and Technology University (China))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-4-04

Analytical models of redistribution layers and through glass vias are proposed. Multi-channel effects including attack and victim lines are taken into account. The calculated S-parameters and eye diagrams are in good agreement with electromagnetic field simulation results.

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