[K-4] Design, Process, and Technology for High-performance Chiplet II/3D Integration and Advanced Packaging II

[K-4-04] Modeling of Redistribution Layers and Through Glass Vias on Glass Interposers

Kai Zhao¹, 〇Haitao He¹, Junchen Dong¹, Yudi Zhao¹ (1. Beijing Information Science and Technology University (China))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-4-04

Analytical models of redistribution layers and through glass vias are proposed. Multi-channel effects including attack and victim lines are taken into account. The calculated S-parameters and eye diagrams are in good agreement with electromagnetic field simulation results.