2022 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-6] MEMS and Advanced Metallization I

Wed. Sep 28, 2022 1:30 PM - 3:30 PM 304 (3F)

Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)

2:00 PM - 2:15 PM

[K-6-02] Evaluating Sintered Silver Die-attach Thermal Cycling Degradation
by Nine Point Cycling Bending Test

〇Keisuke Wakamoto1,2, Takukazu Otsuka1, Ken Nakahara1, Takahiro Namazu2 (1. Rohm Co., Ltd (Japan), 2. Kyoto University of Advanced Science (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.K-6-02

This paper investigates the nine-point bending test (NBT) evaluations for verifying the sintered silver (s-Ag) die degradation m during thermal shocked test (TST) that reflects practical operation in silicon carbide (SiC) power module products. SiC chip was s-Ag bonded at 300℃ un-der a pressure of 60MPa with 64Titanium (64Ti) sub-strate. The assembly was flipped to place onto the eight rounded tip shape pin support jigs arranged in an octag-onal position. The other push pin was motion controlled under triangle wave form with the cycle period in 180 sec, force amplitude in 300N under 150℃. The scanning acoustic tomography (SAT) image was utilized for die de-lamination evaluation during NBT. The delamination was occurred after 400 cycles at the corner of chip, then progressed for in-plane direction. The delamination rate transition during NBT showed similar trends with that in TST up to 800 cycles. That is, mechanical stress plays a main role in the die degradation during TST.

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