2022 International Conference on Solid State Devices and Materials

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-6] MEMS and Advanced Metallization I

Wed. Sep 28, 2022 1:30 PM - 3:30 PM 304 (3F)

Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)

2:45 PM - 3:00 PM

[K-6-05 (Late News)] Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material

〇Takeyasu Saito1, Kazunobu WAKAMATSU1, Kazuki UEDA1, Naoki OKAMOTO1 (1. Osaka Metropolitan Univ. (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.K-6-05

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