Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material

講演情報

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

2022年9月28日(水) 13:30 〜 15:30 304 (3F)

Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)

14:45 〜 15:00

〇Takeyasu Saito¹, Kazunobu WAKAMATSU¹, Kazuki UEDA¹, Naoki OKAMOTO¹ (1. Osaka Metropolitan Univ. (Japan))

Presentation style: On-site (in-person)

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