Ultra-High Packing Density Vertical GaN Nanocolumn SBDs using Bottom-Up Growth Approach

Hiroyuki Shimada

doi:https://doi.org/10.7567/SSDM.2023.A-3-02

9:30 AM - 9:45 AM

[A-3-02] Ultra-High Packing Density Vertical GaN Nanocolumn SBDs using Bottom-Up Growth Approach

^○Hiroyuki Shimada¹, Hironobu Kariyazono¹, Yohei Nakagawa¹, Shinji Terao¹, Kentaro Takayanagi¹, Koichiro Akasaka¹, Shunsuke Ishizawa¹, Koichi Morozumi², Rie Togashi³, Katsumi Kishino³ (1. Core Tech. Development Dept., Seiko Epson Corp. (Japan), 2. Material Analysis & CAE Center, Seiko Epson Corp. (Japan), 3. Sophia Nanotech. Res. Center, Sophia Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.A-3-02

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Presentation information

[A-3] Growth and Synthesis: Low Dimensional Devices and Materials

[A-3-02] Ultra-High Packing Density Vertical GaN Nanocolumn SBDs using Bottom-Up Growth Approach

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