Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

Koichi Motoyama

doi:https://doi.org/10.7567/SSDM.2023.G-1-01

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-1] Advanced Metallization I

Wed. Sep 6, 2023 2:00 PM - 3:30 PM Room G (231, Bldg. 2)

Session Chairs: Christian Dussarrat (Air Liquide), Jenn-Ming Song (National Chung Hsing Univ.)

2:00 PM - 2:30 PM

[G-1-01 (Invited)] Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

^○Koichi Motoyama¹ (1. IBM Res. (United States of America))

https://doi.org/10.7567/SSDM.2023.G-1-01

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Presentation information

[G-1] Advanced Metallization I

[G-1-01 (Invited)] Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

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