Impact of Ru Deposition Method and Adhesion Layer on Electrical Performance of Semi-damascene Interconnects

Gilles Delie

doi:https://doi.org/10.7567/SSDM.2023.G-1-02

2:30 PM - 2:45 PM

[G-1-02] Impact of Ru Deposition Method and Adhesion Layer on Electrical Performance of Semi-damascene Interconnects

^○Gilles Delie¹, Elisabeth Camerotto², Giulio Marti¹, Ankit Pokhrel¹, Gayle Murdoch¹, Anshul Gupta¹, Stefan Decoster¹, Souvik Kundu¹, Seongho Park¹, Zsolt Tokei¹ (1. imec (Belgium), 2. Lam Research Belgium (Belgium))

https://doi.org/10.7567/SSDM.2023.G-1-02

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Presentation information

[G-1] Advanced Metallization I

[G-1-02] Impact of Ru Deposition Method and Adhesion Layer on Electrical Performance of Semi-damascene Interconnects

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