Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node

Chen Wu

doi:https://doi.org/10.7567/SSDM.2023.G-1-03

2:45 PM - 3:00 PM

[G-1-03] Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node

^○Chen Wu¹, Vincent Renaud¹, Stephane Lariviere¹, Stefan Decoster¹, Yannick Hermans¹, Quoc Toan Le¹, Hanne DeCoster¹, Bart Kenens¹, Diana Tsvetanova¹, Alfonso Sepulveda Marquez¹, Gayle Murdoch¹, Seongho Park¹, Zsolt Tokei¹ (1. imec (Belgium))

https://doi.org/10.7567/SSDM.2023.G-1-03

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Presentation information

[G-1] Advanced Metallization I

[G-1-03] Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node

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