Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

Koichi Motoyama

doi:https://doi.org/10.7567/SSDM.2023.G-1-01

講演情報

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-1] Advanced Metallization I

2023年9月6日(水) 14:00 〜 15:30 Room G (231, Bldg. 2)

Session Chairs: Christian Dussarrat (Air Liquide), Jenn-Ming Song (National Chung Hsing Univ.)

14:00 〜 14:30

[G-1-01 (Invited)] Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

^○Koichi Motoyama¹ (1. IBM Res. (United States of America))

https://doi.org/10.7567/SSDM.2023.G-1-01

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講演情報

[G-1] Advanced Metallization I

[G-1-01 (Invited)] Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

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