Optimizations on resistivity of binary compounds for advanced interconnect metallization

Jean- Philippe Soulie

doi:https://doi.org/10.7567/SSDM.2023.G-1-04

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-1] Advanced Metallization I

Wed. Sep 6, 2023 2:00 PM - 3:30 PM Room G (231, Bldg. 2)

Session Chairs: Christian Dussarrat (Air Liquide), Jenn-Ming Song (National Chung Hsing Univ.)

3:00 PM - 3:15 PM

[G-1-04] Optimizations on resistivity of binary compounds for advanced interconnect metallization

^○Jean- Philippe Soulie¹, Nancy Heylen¹, Jeroen Scheerder¹, Claudia Fleischmann^1,2, Zsolt Tőkei¹, Christoph Adelmann¹ (1. Inst. IMEC (Belgium), 2. Univ. of Leuven (KUL) (Belgium))

https://doi.org/10.7567/SSDM.2023.G-1-04

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Presentation information

[G-1] Advanced Metallization I

[G-1-04] Optimizations on resistivity of binary compounds for advanced interconnect metallization

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