2023 International Conference on Solid State Devices and Materials

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-2] MEMS and Advanced Metallization I

Wed. Sep 6, 2023 4:00 PM - 5:30 PM Room G (231, Bldg. 2)

Session Chairs: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

4:00 PM - 4:30 PM

[G-2-01 (Invited)] Strategy of Wafer Bonding Techniques in Commercial MEMS

○Tadashi Inoue1 (1. MMI Semiconductor Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2023.G-2-01

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