2023 International Conference on Solid State Devices and Materials

講演情報

印刷

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-2] MEMS and Advanced Metallization I

2023年9月6日(水) 16:00 〜 17:30 Room G (231, Bldg. 2)

Session Chairs: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)

16:00 〜 16:30

[G-2-01 (Invited)] Strategy of Wafer Bonding Techniques in Commercial MEMS

○Tadashi Inoue1 (1. MMI Semiconductor Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2023.G-2-01

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