Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation

Hemanth Kuamr Cheemalamarri

doi:https://doi.org/10.7567/SSDM.2023.G-5-03

Presentation information

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

Fri. Sep 8, 2023 9:00 AM - 10:15 AM Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

9:45 AM - 10:00 AM

[G-5-03] Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation

^○Hemanth Kuamr Cheemalamarri¹, Gim Guan Chen¹, Hongyu Li¹, Chandra Rao Bhesetti¹, Nagendra Sekhar Vasarla¹, Nandini Venkataraman¹, King Jien Chui¹, Srinivasa Rao Vempati¹, Navab Singh¹ (1. Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), Singapore (Singapore))

https://doi.org/10.7567/SSDM.2023.G-5-03

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Presentation information

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

[G-5-03] Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation

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