2023 International Conference on Solid State Devices and Materials

講演情報

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

2023年9月8日(金) 09:00 〜 10:15 Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

09:45 〜 10:00

[G-5-03] Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation

Hemanth Kuamr Cheemalamarri1, Gim Guan Chen1, Hongyu Li1, Chandra Rao Bhesetti1, Nagendra Sekhar Vasarla1, Nandini Venkataraman1, King Jien Chui1, Srinivasa Rao Vempati1, Navab Singh1 (1. Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), Singapore (Singapore))

https://doi.org/10.7567/SSDM.2023.G-5-03

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