Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

Karl Gerard Herman Ceulemans

doi:https://doi.org/10.7567/SSDM.2023.PS-3-06

[PS-3-06] Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

^○Karl Gerard Herman Ceulemans¹, Ehsan Shafahian¹, Katia Devriendt¹, Herbert Struyf¹, Jaber Derakhshandeh¹ (1. IMEC (Belgium))

https://doi.org/10.7567/SSDM.2023.PS-3-06

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Presentation information

[PS-3] 03: Interconnect / 3D Integrations / MEMS

[PS-3-06] Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

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